In this release we introduce an improved autoplotting algorithm that addresses the problem of deep subsurface inclusions and thick cracks. The average deepness of subsurface markings and point subsurface inclusions was reduced. As for the cracks it is the first release where we are announcing the automatic and semi-automatic plotting of flat cracks. The crack autoplotting works well on standalone non-transparent flat cracks. The result of crack processing is a 20-microns thick flat crack that can be manually edited. Also from this release we support a photorealistic rendering of cracks in planned diamonds. This feature helps to estimate the influence of some crack on visual appearance of the diamond during planning.
In previous release of autoplotting program there was a problem with allocation of subsurface marking and small subsurface inclusions. Most of them were too deepened inside the rough. You can see such a problem on the left picture below (problem zones are near the blue line of rough contour). On the right picture you can see the result of new release program where the average deepness of subsurface inclusion was reduced.
Please do not forget to use the QC-tool for removing subsurface inclusions. From this moment the average deepness of subsurface inclusions was reduced (now it is less then 150-200 microns). So the classification of inclusions into subsurface and not-subsurface has become simpler.
This is the first release where we represent the algorithm for autoplotting flat cracks. When the process of autoplotting is finished you may see autoplotted flat cracks in the list of inclusions:
The new algorithm is tuned for automatic allocation of cracks that are:
Features:
Known issues: